XR2A-1401-N

Category: IC Sockets

Description

CONN IC DIP SOCKET 14POS GOLD

Technical Parameters

Parameter Value
Product Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 14 (2 x 7)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 29.5μin (0.75μm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 29.5μin (0.75μm)
Contact Material - Post Beryllium Copper
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 125°C

Industry News