DILB40P-223TLF

Category: IC Sockets

Description

CONN IC DIP SOCKET 40POS TIN

Technical Parameters

Parameter Value
Product Status Active
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 100.0μin (2.54μm)
Contact Material - Mating Copper Alloy
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 100.0μin (2.54μm)
Contact Material - Post Copper Alloy
Housing Material Polyamide (PA), Nylon
Operating Temperature -55°C ~ 105°C

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